We have state-of-the-art equipment to produce any electronic or electro-mechanical product in the form of printed circuit
assemblies, higher level sub-assemblies or complete box builds.

Our manufacturing technologies include:

  • CSP, uBGA, 0201 components
  • Chip on board (COB)
  • Chip on flex (COF)
  • Anisotropic conductive material such as ACF, ACA, ACI
  • Customised jigs and fixtures for consistency in assembly quality
  • Customised production testers

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